Capabilities

• Electroless NiP
• Electroless NiB 
• Immersion Gold
• Electroless Gold
• Silver Plating
• Selective Plating
• Abrasive Blasting

Precleaning, etching, activation and plating processes have been developed for most microelectronic and high performance base materials. These include among others; metalized ceramics ( alumina, aluminum nitride, BeO, sapphire; Direct Bond Copper, cofired, post-fire metalized, thin film metalized ), plastic packages, laminates and thin-film metalized silicon. We specialize in handling extremely fragile components.

" UltraSource has been using the Component Surfaces electroless gold plating process in specific applications for over 5 years. We have found that this process is very reliable, repeatable and offers superior uniformity and film thickness control over other gold plating processes."

Will Mraz, Vice President
UltraSource, Inc.
Hollis, New Hampshire