Purchase of New Plating Processing Equipment Custom Fabricated by Annmar Industries, Inc. of Anaheim, CA
The installation of this additional plating equipment has increased Component Surfaces, Inc's. capacity by 250%. Along with this expansion, our new production plating process capabilities now include:
Electroless Nickel Plating
(Both NiB and NiP)
Electrolytic Nickel Plating
Electrolytic Copper Plating
Electrolytic Gold Plating
(soft and hardened deposits)
Electrolytic Gold Tin Plating
Electrolytic Indium Plating
Immersion Gold Plating
Electroless Gold Plating
Selective Plating
Quality Assurance Inspection, Testing and Certification
Additional Capacity for New Processing as Required for Future Growth
Component Surfaces, Inc. has the capability to satisfy your production plating requirements.
Contact us and we will be pleased to review your plating requirements with you. We will be glad to provide a quote for processing and/or work with you to develop a strategy for satisfying your requirements. In many cases we will also work with you to develop a processing capability if that is necessary.
Product Applications
Although we participate in the fabrication of products with a variety of applications, we have significant specific industry experience in the following product applications:
Metalized Ceramics for Microelectronic Packaging and Assembly
Thermal Management Materials Such as CuW, CuMo and Cu-CuMo-Cu
Metalized Silicon and PCB Materials
Product Inspection and Test Area
Component Surfaces Quality Assurance personnel inspect materials as delivered for processing, at key points during processing and always as a final step prior to release for packaging and delivery to the customer.
"As a provider of custom metalized and patterned substrates for the microelectronics industries, we have found Component Surfaces to be a highly reliable and responsive source for our electroless nickel and gold plating needs. They are successful plating parts which were hit-or-miss with our previous platers."